[Case Study] Manufacturing: Semiconductor Factory Reduces Process Delays
Serial-to-Ethernet for reducing process latency in semiconductor manufacturing equipment.
The manufacturing of semiconductor wafers is a high-precision process. It is classified into various major process groups such as photolithography, thin films, etching, and CMP, requiring over 300 manufacturing steps. A typical thin film or etching device incorporates many serial devices, such as vacuum turbo pumps, RF generators, and RF matching, all controlled by an internal PC. Japanese companies that manufacture thin film and etching process equipment have developed next-generation device communication solutions. [Case Study] - Industry: Manufacturing (Semiconductor Factory) - Purpose: Reduce process delays - Product: NPort 6650-8 *For more details, please refer to the PDF document or feel free to contact us.
- Company:アイ・ビー・エス・ジャパン
- Price:Other